We specialise in complex electronic circuit assemblies with highest levels of quality.
Our Australian facilities are dedicated to high-tech, time sensitive assemblies with our offshore facilities catering for higher volume cost sensitive projects.
01005 passives & μBGAs to 2000+Pin Ultra Big Chiplet FPGAs.
No footprint is too small or too complex.
Single point of contact for all PCB fabrication and PCB assembly needs, from prototype through to mass production.
Our team specialise in complex electronic assemblies where time to market, quality and reliability are essential. All circuits are assembled and inspected against the latest and most stringent IPC standards through a meticulous & established process, using a mix of latest automated and manual inspection equipment both during and post-assembly, providing highest levels of quality assurance.
Complex printed circuit board assemblies are regularly loaded for Aerospace, Defence, Automotive and other industries, where failure is not an option.
Our circuit assembly portfolio includes largest size BGA footprints (70mm x 74mm) right down to 01005 passives with turnaround times as fast as 2 working days.
|IC Footprints||BGA, uBGA, QFN, QFP, CSP and leadless devices down to 0.30mm pitch|
|Chip Footprints||01005, 0201, 0402, 0603, 0805 and above|
|Loading||SMT, Press-fit, Through-hole, Paste in Hole, Selective & Edge soldering|
|Capacity||35,000,000+ placements per day|
|Solder Compound||RoHS Leadfree, Leaded, Low Temp, Clean & No Clean Chemistry|
|Environmental||Conformal Coating, E-poxy Potting, Silicon Potting, Thermal Stress Cycling|
|Inspection||AOI, SPI, AXI, 3D Xray, High Mag 180x Stereo Microscope, Ersascope|
|Testing||Automated & Semi-Automated, Bed of Nails, Flying Probe, RF, ICT|
|Certifications||ISO 9001:2015, AS9100*, ISO9001/14001*, RoHS, WEEE, REACH|
Single point of contact for all PCB fabrication and assembly requirements.
Fastest turnaround times in the industry.
Providing complex solutions for critical industries where failure is not an option.