Launch of the New Virtex UltraScale+ FPGA for Evolved Connectivity
Xilinx has announced the launch of their latest Virtex UltraScale+ FPGA device that meets the current demands for evolved connectivity.
Xilinx has announced the launch of their latest Virtex UltraScale+ FPGA device that meets the current demands for evolved connectivity.
Challenges of Aligning Multiple Connector Sets in Complex Stacked PCBs
Increased density, cost, shrinking footprints and higher data rates are just some of the connector sets related challenges in complex stacked PCBs.
Increased density, cost, shrinking footprints and higher data rates are just some of the connector sets related challenges in complex stacked PCBs.
April 2020
Understanding IPC Class 2 Vs Class 3 for a Gull Wing Lead
IPC-A-610 covers a wide range of solder joints, and what it takes to meet Classes 1 – 3 in varying types of connector termination styles
March 2020
5G Expected to Account for 20 Percent of Global Connections by 2025
Future of 5G: By 2023, the GSMA expects to see 5G overtake 2G with more than a billion connections, and forecast to hit 1.8 billion by 2025
February 2020
Altium Redefines PCB Design Sharing & Visualization with the Power of the Cloud
Sharing and collaboration within the electronics supply chain just got easier
Si-Fly™ 112 Gbps PAM4 System Announced by Samtec
Samtec’s direct connect technology, which includes two interconnects: FireFly™ and Si-Fly™. Available now.
January 2020
Investing in Industry 4.0
IPC Launches IPC CFX Industry Support Programs
December 2019
Printed Circuit Board Design Guide by IPC
IPC Delivers Introduction to Printed Circuit Board Design
Microvia Reliability for High Performance Products
IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products
