June 2021
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Ambarella, Lumentum & ON Semiconductor's Collaboration on AI processing based 3D sensing, Next-gen AIoT Devices
ON Semiconductor recently announced its collaboration with Ambarella & Lumentum; creating new joint reference designs offering industry-first approaches for biometric access control, 3D electronic locks & intelligent sensing across verticals.
ON Semiconductor recently announced its collaboration with Ambarella & Lumentum; creating new joint reference designs offering industry-first approaches for biometric access control, 3D electronic locks & intelligent sensing across verticals. -
Samtec's New Micro Power Connectors: Cable Assembly & Board-to-Board Systems
The new Samtec mPOWER connector system is a micro, high-power solution with incredible design flexibility for power-only or power/signal applications.
The new Samtec mPOWER connector system is a micro, high-power solution with incredible design flexibility for power-only or power/signal applications.
May 2021
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Xilinx Has Announced Full Production Shipments of 7nm Versal AI Core & Versal Prime Series Devices
Xilinx is now shipping its Versal AI Core and Versal Prime series devices to customers in full production volumes. Versal Premium has also now been shipped to multiple tier-one customers.
Xilinx is now shipping its Versal AI Core and Versal Prime series devices to customers in full production volumes. Versal Premium has also now been shipped to multiple tier-one customers. -
IBM Launches Advanced Storage Solutions Designed to Simplify Data Accessibility & Availability Across Hybrid Clouds
IBM has announced major innovations across its storage portfolio designed to improve the access to, and management of, data across increasingly complex hybrid cloud environments for greater data availability and resilience.
IBM has announced major innovations across its storage portfolio designed to improve the access to, and management of, data across increasingly complex hybrid cloud environments for greater data availability and resilience. -
Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation & AI Applications
Production-ready embedded boards and low-cost developer kit accelerate design cycles for rapid deployment; initial products target vision AI applications in smart cities and factories
Production-ready embedded boards and low-cost developer kit accelerate design cycles for rapid deployment; initial products target vision AI applications in smart cities and factories
April 2021
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Samtec Flyover® Technology Lowers HFT Latency
Samtec Flyover Technology can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus legacy PCB-based designs.
Samtec Flyover Technology can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus legacy PCB-based designs. -
Gen-Z Enables Heterogeneous Computing Networks
Gen-Z technology is a universal interconnect system and fabric technology that’s built from the ground up. It’s an open-systems fabric – based architecture designed to interconnect processors, memory devices, and accelerators.
Gen-Z technology is a universal interconnect system and fabric technology that’s built from the ground up. It’s an open-systems fabric – based architecture designed to interconnect processors, memory devices, and accelerators. -
Stay Competitive with IPC Standards (Release of 5 new standards to optimise electronics manufacturing industry)
New standards released by IPC to help the electronics industry build electronics better.
New standards released by IPC to help the electronics industry build electronics better.
March 2021
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Is This The Swiss Army Knife Of Connectors?
A new connector set that offers designers tremendous design versatility, kind of like a Swiss army knife.
A new connector set that offers designers tremendous design versatility, kind of like a Swiss army knife.
