May 2020
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Launch of the New Virtex UltraScale+ FPGA for Evolved Connectivity
Xilinx has announced the launch of their latest Virtex UltraScale+ FPGA device that meets the current demands for evolved connectivity.
Xilinx has announced the launch of their latest Virtex UltraScale+ FPGA device that meets the current demands for evolved connectivity. -
Challenges of Aligning Multiple Connector Sets in Complex Stacked PCBs
Increased density, cost, shrinking footprints and higher data rates are just some of the connector sets related challenges in complex stacked PCBs.
Increased density, cost, shrinking footprints and higher data rates are just some of the connector sets related challenges in complex stacked PCBs.
April 2020
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Understanding IPC Class 2 Vs Class 3 for a Gull Wing Lead
IPC-A-610 covers a wide range of solder joints, and what it takes to meet Classes 1 – 3 in varying types of connector termination styles
March 2020
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5G Expected to Account for 20 Percent of Global Connections by 2025
Future of 5G: By 2023, the GSMA expects to see 5G overtake 2G with more than a billion connections, and forecast to hit 1.8 billion by 2025
February 2020
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Altium Redefines PCB Design Sharing & Visualization with the Power of the Cloud
Sharing and collaboration within the electronics supply chain just got easier
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Si-Fly™ 112 Gbps PAM4 System Announced by Samtec
Samtec’s direct connect technology, which includes two interconnects: FireFly™ and Si-Fly™. Available now.
December 2019
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Delay Tuning for High Speed Signals: What You Need to Know
A short guide from Altium
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World's Highest Capacity FPGA by Intel
Intel Announces World's highest capacity FPGA to be launched in Q1, 2020 Before Xilinx
