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48 Resources

June 2021

  • Samtec Flyover Twinax Cable enables 112 Gbps PAM$ performance
    Samtec's Flyover Twinax Enables112 Gbps PAM4 Rack-to-Rack Interconnect With Remarkable Results
    Samtec Flyover Twinax Cable assemblies allow designers to extend signal reach and density, enabling 112 Gbps PAM4 performance.
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    Samtec Flyover Twinax Cable assemblies allow designers to extend signal reach and density, enabling 112 Gbps PAM4 performance.
  • AI processing based 3D sensing, Next-gen AIoT, ON semiconductor, sourceman engineering
    Ambarella, Lumentum & ON Semiconductor's Collaboration on AI processing based 3D sensing, Next-gen AIoT Devices
    ON Semiconductor recently announced its collaboration with Ambarella & Lumentum; creating new joint reference designs offering industry-first approaches for biometric access control, 3D electronic locks & intelligent sensing across verticals.
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    ON Semiconductor recently announced its collaboration with Ambarella & Lumentum; creating new joint reference designs offering industry-first approaches for biometric access control, 3D electronic locks & intelligent sensing across verticals.
  • New micro power connectors samtec, sourceman engineering technical resources
    Samtec's New Micro Power Connectors: Cable Assembly & Board-to-Board Systems
    The new Samtec mPOWER connector system is a micro, high-power solution with incredible design flexibility for power-only or power/signal applications.
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    The new Samtec mPOWER connector system is a micro, high-power solution with incredible design flexibility for power-only or power/signal applications.

May 2021

  • Xilinx Full Production Shipments of 7nm Versal AI Core & Versal Prime Series Devices Sourceman International Engineering Technical Resources
    Xilinx Has Announced Full Production Shipments of 7nm Versal AI Core & Versal Prime Series Devices
    Xilinx is now shipping its Versal AI Core and Versal Prime series devices to customers in full production volumes. Versal Premium has also now been shipped to multiple tier-one customers.
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    Xilinx is now shipping its Versal AI Core and Versal Prime series devices to customers in full production volumes. Versal Premium has also now been shipped to multiple tier-one customers.
  • IBM Advanced Storage Solutions to Simplify Data Accessibility Availability Across Hybrid Clouds Sourceman Technical Resource
    IBM Launches Advanced Storage Solutions Designed to Simplify Data Accessibility & Availability Across Hybrid Clouds
    IBM has announced major innovations across its storage portfolio designed to improve the access to, and management of, data across increasingly complex hybrid cloud environments for greater data availability and resilience.
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    IBM has announced major innovations across its storage portfolio designed to improve the access to, and management of, data across increasingly complex hybrid cloud environments for greater data availability and resilience.
  • Xilinx Adaptive System on Modules Accelarating Innovation Sourceman International Engineering Resources
    Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation & AI Applications
    Production-ready embedded boards and low-cost developer kit accelerate design cycles for rapid deployment; initial products target vision AI applications in smart cities and factories
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    Production-ready embedded boards and low-cost developer kit accelerate design cycles for rapid deployment; initial products target vision AI applications in smart cities and factories

April 2021

  • Samtec flyover technology lowers HFT latency Sourceman engineering technical resources
    Samtec Flyover® Technology Lowers HFT Latency
    Samtec Flyover Technology can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus legacy PCB-based designs.
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    Samtec Flyover Technology can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus legacy PCB-based designs.
  • Gen Z enabling heterogeneous computing network Sourceman engineering technical resources
    Gen-Z Enables Heterogeneous Computing Networks
    Gen-Z technology is a universal interconnect system and fabric technology that’s built from the ground up. It’s an open-systems fabric – based architecture designed to interconnect processors, memory devices, and accelerators.
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    Gen-Z technology is a universal interconnect system and fabric technology that’s built from the ground up. It’s an open-systems fabric – based architecture designed to interconnect processors, memory devices, and accelerators.
  • Release of five new standards to optimise electronics manufacturing policy sourceman engineering technical resources
    Stay Competitive with IPC Standards (Release of 5 new standards to optimise electronics manufacturing industry)
    New standards released by IPC to help the electronics industry build electronics better.
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    New standards released by IPC to help the electronics industry build electronics better.