At the core of any electrical or electronic equipment is a PCB. It plays a critical role in the effective function of the product.
Therefore, its reliability ensures the product performs as it is designed for the entire duration of its life cycle.
Our team of experts have extensive knowledge of PCB fabrication processes and always seek to be at the forefront of PCB technology development; enabling them to actively cooperate with our clients’ engineering team at early stages of the design phase of their projects.
This approach ensures best design practices are carried right from the design phase through to mass production, combined with the latest manufacturing technologies, whether the PCB design is 2 layers or 40+ layers, you can rest assured, we have you covered.
Our PCB portfolio includes Multilayer High Speed designs, Thick-board Backplanes, HDI designs, Blind/buried vias, Stacked via structures, Flex and Rigid-Flex, Heavy copper, Ceramics as well Aluminium boards.
Fast-turn fabrication can be arranged in as little as 4-10 Working days for time-critical projects depending on technology demands of the design including transit times.
FABRICATION CAPABILITY SUMMARY
|Board types||High layer count Rigid, Flex, Rigid Flex, Hybrid Stack, HDI with BVH/VIPPO/STACKED via, Heavy Copper, RF, Metal Backed|
|Layer count||2-60 Layers|
|Min trace width / spacing||0.0508mm (0.002″)|
|Min soldermask gap||0.10mm (0.004″)|
|Max aspect ratio||25:1|
|Min via size||0.076 (0.003″)|
|Back-drill stub tolerance||0.10mm (0.004″)|
|Board thickness||0.20mm – 8.00mm (0.008″-0.315″)|
|Max panel size||584mm x 889mm (23″ x 35″)|
|Max copper weight||12oz|
|Board finish||OSP, ENIG (Immersion Gold), Electrolytic Gold, Immersion Silver, Immersion Tin, Selective ENIG + OSP, Lead Free HASL|
|Materials||Panasonic, Doosan, Isola, Rogers, Dupont|
|Soldermask colors||Green, Black, Red, Blue, Orange, White, Yellow|
|Standard test procedures||Flying Probe Test, Microsection Analysis, 120x High Magnification Inspection|
|Other optional tests||High voltage surge test, Impedance control test, Soldering capacity, Thermal shock, Insulation resistance test, Ionic cleanliness test, X-ray analysis|
|Other capabilities||Carbon ink, Peelable solder mask|
Experts in High Tech PCB fabrication with leading-edge manufacturing technologies.
All plants are UL and IPC certified with additional QC/QA steps specifically designed for highest possible reliability rating.
Fastest turnaround times in the industry.