High Density Interconnected PCBs (HDI)
Our team of experts have extensive experience with High Density Interconnect PCBs.
HDI circuits are traditionally defined as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB) which normally also incorporate microvia structures.
With a large portfolio of HDI for various clients in demanding industries, we have the comprehensive knowledge and manufacturing expertise to provide you with the best quality HDI boards.
| Feature | Sourceman´s Technical Specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 610mm x 450mm; dependent upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
At Sourceman International, we are ready to meet any challenge.
The need for reliable and efficient HDI PCBs has never been greater. . Start a conversation with us today.
Along PCB supply, we also offer other turnkey solutions, including fast turn prototyping, CNC machining and direct metal laser sintering.