High Density Interconnected PCBs (HDI)
Our team of experts have extensive experience with High Density Interconnect PCBs.
HDI circuits are traditionally defined as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB) which normally also incorporate microvia structures.
With a large portfolio of HDI for various clients in demanding industries, we have the comprehensive knowledge and manufacturing expertise to provide you with the best quality HDI boards.
|Sourceman´s Technical Specification
|Number of layers
|4 – 22 layers standard, 30 layers advanced
|Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
|1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
|FR4 standard, FR4 high performance, Halogen free FR4, Rogers
|Copper weights (finished)
|18μm – 70μm
|Minimum track and gap
|0.075mm / 0.075mm
|0.40mm – 3.20mm
|610mm x 450mm; dependent upon laser drilling machine
|Surface finishes available
|OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
|Minimum mechanical drill
|Minimum laser drill
|0.10mm standard, 0.075mm advanced
At Sourceman International, we are ready to meet any challenge.