Radio Frequency PCBs (RF)
Radio frequency (RF) and microwave (MW) circuits can be found in wireless products from handheld devices for medical and industrial applications to advanced communications systems for base stations, radar and global positioning.
Sourceman works closly with our clients to insure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DFM considerations.
When producing radio frequency PCBs it is important to think about optimum signal paths using materials types and material characteristics (loss tangent / Df and dielectric constant / Dk), copper foil profiles, weave styles as well as general layout of the copper circuitry. All of these factors have a significant impact on the the performance of the finished product.
At Sourceman, we pride ourselves on our expertise when it comes to RF boards – Our team of experts bring the most demanding layout concepts to reality.
Features | Sourceman’s Technical Specification |
Number of layers | 2-20 layers |
Technology highlights | Controlled impedance, low loss materials, miniaturization |
Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
Dielectric thickness | 0.1mm – 3.0mm |
Profile method | Routing, v-score |
Copper weights (finished) | ½ to 6 ounces |
Minimum track and gaps | 0.075mm / 0.075mm |
Metal core thickness | 0.4-2mm post bonded |
Maximum dimensions | 580mm x 1010mm |
Surface finishes available | HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver |