Backplane PCBs are the gateway to higher technology applications.
Benefits include elimination of "jumper" cabling with larger sized backplanes hence improving reliability, lower assembly cost and stronger signal integrity.
In addition, their copper weight variability can carry high speed signals or power with ease. They also allow for a wide range of material selections to suit the design from power to high speed (100Gbp) applications.
A wide range of materials for high speed circuit boards are offered to clients. The differences based on material selection can be very large. Material selection depends on not only loss factors, but one must take account of all of the properties to make an optimal choice of material. The price/performance ratio may also vary widely.
As industry demand for these boards increase, our team at Sourceman, continue to provide our clients with unparalleled support as required with the fastest industry turn around times.
|Sourceman Technical Specification
|Number of layers
|4 – 38 layers standard, 40+ layers advanced, 60 layers prototype.
|Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
|High performance FR4, halogen-free FR4, low loss and low Dk materials
|Copper weights (finished)
|18μm – 210μm, advanced 1050μm / 30oz
|Minimum track and gap
|0.075mm / 0.075mm
|2mm – 7.0mm
|580mm x 1080mm, advanced 610mm x 1400mm
|Surface finishes available
|HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
|10:1 to 20:1
|Minimum mechanical drill
|Minimum laser drill
|0.10mm standard, 0.075mm advanced